Deliver laser solutions that drive innovations in display performance and production, especially for mobile devices.
- Improve Precision Combining high-spatial precision and selectivity for advanced display production.
- Increase Productivity Offering fast, large area processing for current and future generation modules and panels.
- Maximize Yield Maintaining superior yield along the process chain from backplane to individual display.
Excimer Laser Annealing
Coherent pioneered the development of Excimer Laser Annealing for producing Low Temperature Polysilicon TFTs (LTPS and LTPO backplanes) enabling high resolution OLED and MicroLED displays.
Laser Lift-Off (LLO) gently separates the flexible OLED displays from rigid carriers as well as MicroLED dies from the growth wafer. Scalable UV laser power ensures high throughput and yield.
Flexible OLED Cutting
Ultrashort Pulse and CO₂ lasers perform singulation and trimming of flexible OLEDs, with small kerf width and minimal process affected zone, at high throughput.
Excimer laser based Laser Lift-Off (LLO), Laser Induced Forward Transfer (LIFT), and Individual Pixel Repair are key processes in mass production of MicroLED displays.
Sapphire Wafer Dicing
Ultrashort pulse laser dicing of LEDs fabricated on sapphire substrates for lighting applications reduces production costs and enhances yields.
Amplifier Stability Enables in-situ Studies of Ferroelectric Film Polarization
See how researchers successfully used Coherent Astrella/TOPAS to determine both the degree and direction of polarization, in films from zero to 20 unit cells (u.c.).