Materials

Metal Matrix Composites

Improve the thermal stability of semiconductor processing equipment with materials that offer a unique mix of high specific stiffness and high thermal stability.

Coherent COGENTUM metal matrix technology provides designers with unparalleled flexibility to improve semiconductor equipment performance and meet the challenges of advanced Integrated circuit processing and packaging technologies.

COGENTUM Properties

Choose from a range of composites which can be cast into structures over 2 meters by 2 meters in size.

Property

Base Al (AA360)

CONGENTUM® GREEN

CONGENTUM ® BLUE

CONGENTUM ® GOLD

Density (g/cc) [ρ]

2.68

2.76

2.80

2.95

Young’s Modulus (GPa) [E]

70

128

143

200

Poisson’s Ratio

0.3

0.29

0.28

0.25

CTE, 20-100ºC (ppm/K) [α]

22

13

12

11

Thermal Cond. (W/m-K) [k]

146

160

164

160

Ult. Tensile Strength (MPa)

312

290

296

340

Damping Factor (% Zeta)

0.08

0.25

0.27

0.58

Specific Stiffness (E/ρ)

26

46

51

68

Thermal Stability (k/α)

7

12

14

15