BEOL – Dicing, Packaging, Bonding, & Test

Build dicing, packaging, and test equipment with higher throughput and accuracy, using components cast from advanced materials.

  • Minimize Vibration Reduce the effects of mechanical vibration caused by accelerating to higher speeds.
  • Dissipate Heat Avoid thermal problems that can arise with faster motorized assemblies.
  • Higher Throughput Deliver stable processing at the higher speeds needed in next-gen BEOL.
BEOL – Dicing, Packaging, Bonding, & Test
BEOL Dicing, Packaging, and Testing

Higher Throughput

Back-end-of-line (BEOL) semiconductor processing is increasing the speed of all key processes. But as the wafer stages move at higher speed, new materials are needed to reduce the effects of vibration and heat generated by motorized assemblies. Our metal matrix composite materials are ideal for casting parts that feature tight tolerances, high surface flatness, high stiffness, high thermal conductivity, and low weight. This enables your BEOL equipment to operate at high speeds with high mechanical accuracy and high yields.

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