Lasers

AVIA LX


Perform PCB/SIP drilling, cutting, trenching, and de-paneling, plus flex/LCP/LTCC processing, with minimized heat affected zone and no post cleaning needed.

The AVIA LX combines high pulse energy and repetition rate with UV output to enable rapid, precision materials processing in semi fab, advanced packaging and solar cell manufacturing. It offers exceptional reliability for a high-power UV source.


High Pulse Energy UV Output

Select from three different output powers, each of which can operate over a range of peak powers and repetition rates to allow optimization for specific materials.

 

Product Specifications

Model

Beam Diameter (mm)

Output Power (W) 

Pulse Energy (μJ) 

Repetition Rate (kHz)

AVIA LX 355-10-50 

3

 >10 at 50 kHz 

≤200

Single-shot - 150

AVIA LX 355-20-50 

1.5 

>20 at 50 kHz  

≤400  

Single-shot - 300 

AVIA LX 355-20-100  

1.5 

>20 at 100 kHz  

≤200  

Single-shot - 300 

AVIA LX 355-20-40 HE 

1.5 

>20 at 40 kHz  

≤500  

Single-shot - 100 

AVIA LX 355-30-60 HE 

3

>30W at 60 kHz 

≤500

 

Single-shot - 300

 

Related Products

Resource List 

Solutions