Laser Machines and Systems

WaferLase Series


Perform high-speed silicon wafer marking and glass scribing for NGS Flow Cell production with automated tools that deliver high precision with minimal heat damage.

WaferLase systems combine robotic part handling, automated part alignment, a laser source, beam delivery optics, and control and interface software. System components are mounted on a granite base within a welded steel frame for maximum stability.


Semiconductor Wafer Marking and Glass Scribing

Select the laser source, part transport, and other automation options to configure a WaferLase processing system that is right for your application and budget.

 

Product Specifications

Model

Application

WaferLase ID 200  

Silicon wafer ID marking up to 200 mm 

WaferLase II 

Glass Cutting for NGS Flow Cell Production 

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