Laser Machines and Systems

WaferLase Series

Perform high-speed silicon wafer etching, marking, and glass scribing for NGS Flow Cell production with automated tools that deliver high precision with minimal heat damage.

WaferLase systems combine robotic part handling, automated part alignment, a laser source, beam delivery optics, and control and interface software. System components are mounted on a granite base within a welded steel frame for maximum stability.

Semiconductor Wafer Marking and Glass Scribing

Select the laser source, part transport, and other automation options to configure a WaferLase processing system that is right for your application and budget.

 

Product Specifications

Model

Application

WaferLase ID 200  

Silicon wafer ID marking up to 200 mm 

WaferLase II 

Glass Cutting for NGS Flow Cell Production 

Featured Blog

WaferLase II Streamlines NGS Flow Cell Production

The new Coherent WaferLase II automated glass cutting systems combines automation with the proprietary SmartCleave technology for an environmentally friendly, low-cost production solution for Next Generation Sequencing (NGS) Flow Cells.

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