Laser Machines and Systems | Coherent
WaferLase Series
Perform high-speed silicon wafer marking and glass scribing for NGS Flow Cell production with automated tools that deliver high precision with minimal heat damage.
WaferLase systems combine robotic part handling, automated part alignment, a laser source, beam delivery optics, and control and interface software. System components are mounted on a granite base within a welded steel frame for maximum stability.
Semiconductor Wafer Marking and Glass Scribing
Select the laser source, part transport, and other automation options to configure a WaferLase processing system that is right for your application and budget.
Product Specifications
Model Name |
Laser Type |
Main Features |
Target Materials |
Typical Applications |
PowerLine C |
CO2 |
Economical, Versatile |
Most Non-Metals |
Engraving glass, organics, and natural materials. |
PowerLine E 8 QT |
High Power (6 W) UV |
High Speed, High Contrast |
Plastics |
Marking of organics by bleaching. |
PowerLine E Series |
Solid State (IR, Green or UV) |
High-Quality Marks |
Diverse, Laser Dependent |
Semiconductor device marking, marking of organics by foaming, day & night, and grayscale marking. |
PowerLine E Twin |
Solid State (IR, Green or UV) |
High-Quality, Very High Speed |
Organics |
Serialization marking of semiconductor devices. |
PowerLine F Series |
Air-Cooled Fiber Laser IR |
Cost-Effective |
Metals, Plastics |
Engraving/marking of metals, marking of lead frames, ear tag marking, marking of organics by carbonization. |
PowerLine Prime |
Solid State IR |
Compact, Air-Cooled |
Plastics |
General marking in low or medium volume production. |
PowerLine Rapid NX |
USP IR |
Laser Black Marking |
Steel, Titanium, Aluminum |
Laser black marking. |
Product Specifications
Model |
Application |
WaferLase ID 200 |
Silicon wafer ID marking up to 200 mm |
WaferLase II |
Glass Cutting for NGS Flow Cell Production |
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