Laser Machines and Systems
WaferLase Series
Perform high-speed silicon wafer marking and glass scribing for NGS Flow Cell production with automated tools that deliver high precision with minimal heat damage.
WaferLase systems combine robotic part handling, automated part alignment, a laser source, beam delivery optics, and control and interface software. System components are mounted on a granite base within a welded steel frame for maximum stability.
Semiconductor Wafer Marking and Glass Scribing
Select the laser source, part transport, and other automation options to configure a WaferLase processing system that is right for your application and budget.
Product Specifications
Model |
Application |
WaferLase ID 200 |
Silicon wafer ID marking up to 200 mm |
WaferLase II |
Glass Cutting for NGS Flow Cell Production |
Related Products
Solutions
Semiconductor Manufacturing
Support fabs from the most advanced transistor nodes to legacy nodes by locating and avoiding defects, and processing advanced materials like low-κ dielectrics.
