Buyer's Guide to Cutting Lasers

Learn to ask the right questions when choosing a cutting laser to get the capabilities, performance, reliability, cost, and support that will guarantee success in your application.
Buyer's Guide Laser Cutting

Table of Contents

Why Use Lasers for Cutting?

Laser cutting offers numerous advantages over other methods. These include:

  • Non-contact processing which avoids damaging parts.
  • Zero tool wear, which lowers downtime and tool replacement costs.
  • Highly consistent results.
  • Unparalleled mechanical precision and the ability to produce fine details.
  • Better edge quality and less debris than other methods which minimizes post-processing.
  • Faster than other methods.
  • Smaller kerf widths, which increase production efficiency and lowers cost.
  • Highly versatile, allowing easy reconfiguration to meet changing production requirements. 

For all these reasons, and more, lasers are used to cut an incredibly diverse range of materials and achieve a wide variety of end results. They’re used for high-speed cutting of thick steel tubes and plates in the energy industry, precision cutting of thin glass and sapphire sheets for smartphones and tablets, trimming nylon automotive airbags, cutting paper and plastic films for consumer goods packaging, cutting semiconductor chip packaging, and much more. 

There are many types of lasers that service this broad spectrum of cutting applications. And sometimes laser manufacturers even create specific models that are optimized for a particular process. Choosing the right laser for your application from this tremendous selection of commercially available products can seem like an overwhelming task. Overwhelmed? Don’t worry. That’s exactly why we created this Buying Guide.

How to Use this Buyer’s Guide

The purpose of this Buyer’s Guide to Cutting Lasers is to help you select a cutting laser. We’re not going to tell you which laser to buy or which company to buy it from. However, we are going to provide you with a lot of context so you feel confident when you’re ready to make a purchase decision. More than anything else, our goal is to educate you on what questions to ask when you’re researching buying a cutting laser. 

TIP: The Overview Chart provided lists the main types of cutting lasers currently available and is a great place to start your journey. Links embedded in the Overview Chart will take you to more information on the lasers themselves, or directly into the sections of this document that offer guidance on which of these technologies is usually most appropriate for a given application. 

Getting this application specific information isn’t always straightforward because many vendors only offer a limited range of laser technologies. As a result, they promote what they have as being optimal for every use, whether it is or not. 

Coherent is one of the world’s largest laser companies, and a global leader in materials and networking, as well. We service numerous cutting applications for the industrial, communications, microelectronics, instrumentation markets, and more. Most importantly, Coherent manufactures a comprehensive range of cutting lasers, covering virtually every technology currently in use. This allows us to provide unbiased recommendations based solely on your unique needs and project requirements. 

But what are your unique needs and project requirements? A critical first step in making an informed purchasing decision is properly identifying the considerations that are most significant in your own application. Some of the most common of these include:

  • Technical factors, such as material compatibility, throughput speed, and cut quality
  • Cost considerations , such as purchase price, maintenance costs, consumables, and operating costs
  • Integrations factors, such as supported interfaces and communications protocols, and product size and weight
  • Service, such as the geographic availability of spare parts and maintenance, and service response speed
  • Applications support, such as vendor willingness to process samples, and aid in process development

A more detailed treatment of the typical considerations involved in cutting laser selection is provided in the Cutting Laser Selection Checklist .

Cutting Laser Overview

This table lists the most commonly employed cutting lasers and provides a broad summary of their key characteristics and applications. Its purpose is to allow you to quickly identify the laser type(s) most likely to be useful for a specific application and therefore narrow your search.

Note: It shows the primary cutting mechanism for each laser type. Technical information on these processes is provided in the sections on Laser Cutting Mechanisms. Photothermal Cutting, and Photoablative Cutting.

Cutting Laser Overview

Cutting lasers comprise a wide range of wavelengths, pulse lengths, and output powers.

 

Laser Type Average Power Range Wavelength Primary Cutting Mechanism Key Characteristics Material Compatibility Typical Applications Typcial Lifespan
Fiber W - kW 1 µm Photothermal High efficiency
Low maintenance
Compact Size
Fiber delivered		 Metals Automotive
Fabricating
Aerospace
Energy
Medical Devices
Toos & Die		 High
(50,000+ hours)
CO2 W - kw 10.6 µm Photothermal Unique long-wave infrared output
Material versatility
Good edge quality
Complicated beam delivery		 Wood
Paper/Cardboard
Natural and Synthetic Textiles
Leather
Plastics
Rubber
Composites
Glass
Ceramics		 Packaging
Textiles
Signage
Modelmaking		 Medium
(20,000+ hours)
Nanosecond Solid State W - kW 1 µm
532 nm
355 nm		 Photothermal Broad material applicability
High precision
Typically moderate throughput		 Metals
Ceramics
Polymers
Composites
Semiconductors		 Electronics
Medical Devices
Semiconductor
Automotive
Precision Manufacturing		 Medium
(20,000+ hours)
Ultrashort Pulse W - 100 W 1 µm
532
355		 Photoablation Ultimate precision
Minimal heat-affected zone
Extraordinary precision
Broad material applicability
Usually lowest throughput		 Metals
Cerramics
Polymers
Glass & Transparent Materials
Semiconductors		 Displays Electronics
Glass
Medical Devices
Semiconductor
Automotive
Precision Manufacturing		 Medium
(20,000+ hours)

Laser Cutting Mechanisms

All solid substances are held together by bonds or attractive forces between the atoms, ions, or molecules that compose the material. At the most basic level, cutting any solid substance requires breaking those bonds.  

In traditional mechanical cutting, such as with a saw or knife, the cutting tool applies force to the material over an area concentrated around the tool edge. This creates a shear which stretches the bonds between those particles being subjected to the force and neighboring ones which are not. If the force is sufficiently strong, the bonds will break. This is the fundamental physical process that occurs whether it’s cutting paper with scissors, sawing lumber, or carving a roast. 

Lasers are non-contact tools. They do not impart physical force to objects they illuminate. Instead, they cut using entirely different mechanisms. However, they must still accomplish the same end result, namely, breaking atomic or molecular bonds over a contiguous region to produce a cut. 

 

Laser Cutting Mechanisms

The two basic mechanisms of laser cutting are photothermal and photoablative interactions.

 

In the most general terms, lasers perform this bond breaking through two basic mechanisms. These are photothermal and photoablative interactions. And it’s not uncommon for a combination of the two to occur within a single process.

Photothermal Cutting

In a photothermal process, material is removed through intense, spatially localized heating induced by laser light. Generally, the laser light used has a photon energy lower than the energy required to directly break atomic or molecular bonds in the material. 

Laser photons are absorbed by the material, increasing the vibrational energy of its atoms and molecules. Although a single photon does not have enough energy to break a bond directly, the accumulated energy from many absorbed photons causes the atoms and molecules to vibrate more vigorously, thereby heating the material. This increasing thermal energy eventually exceeds the bond dissociation energy.

What happens next depends upon the material and the energy involved, and varies significantly across material types, such as metals, ceramics, semiconductors, and organic materials. It some cases it causes the material to melt, which means the bonds are weakened and partially broken and the material transitions from solid to liquid state. Alternately, if the thermal energy provided is sufficient to completely break the bonds holding the molecules or atoms in the liquid state, it will be vaporized. That is, converted directly into a gas or plasma. Or, for certain materials, high temperatures cause specific chemical bonds to break, leading to decomposition into simpler substances. 

But, no matter what the exact mechanism, material is removed by the photothermal process (if it liquifies the material, then that liquid is usually blown away with gas). The beam is moved over the work piece to remove this material over a contiguous area and create a cut. 

Photoablative Cutting

Photoablation is typically accomplished using a laser having sufficient photon energy to directly break the atomic or molecular bonds. So, instead of gradually increasing the overall thermal energy of the material until the bonds are weakened or broken through accumulated vibrational energy, the bonds are simply dissociated all at once. This doesn’t impart much energy into the material as a whole; in other words, it doesn’t heat it. As a result, photoablation is usually considered a “cold” process. 

There are two ways to provide enough laser energy to directly dissociate bonds. The first relies on linear absorption in the material using a photon having greater energy than the substance’s chemical bond energy. This virtually always requires an ultraviolet (UV) laser, because the atomic and molecular bonds in most solid materials have a dissociation energy that corresponds with UV photons or even shorter wavelengths. This is because photon energy increases as wavelength decreases, so UV light has a shorter wavelength than visible or infrared light.

The second photoablation mechanism utilizes a laser with sufficiently high peak-pulse power to drive non-linear absorption. In this kind of “multiphoton” process, a single electron in the material absorbs the energy of two or more photons simultaneously. Even though the individual photons might not have sufficient energy to break the bond, their combined energy will. The peak powers required to drive non-linear absorption are usually only achieved using an ultrashort pulse (USP) laser. It’s quite common to use an ultraviolet wavelength USP and therefore combine both the linear and non-linear absorption mechanisms. 

 

Cutting Method Tradeoffs

Which cutting method is best? The answer to that depends entirely upon the application, and each process has its place. In general, the characteristics and tradeoffs of each technique are as follows:

Photothermal Cutting
  • Faster than photoablation.
  • Rapid material removal rates useful in high-throughput production applications.
  • Good for covering large areas.
  • Heats the work piece and produces a heat affected zone (HAZ).
  • Not usually used with heat sensitive parts or smaller work pieces, or to cut intricate features.
  • Depends on linear absorption, so laser wavelength must match material absorption.
Photoablative Cutting
  • “Cold” process which minimizes HAZ (often just tens of microns).
  • Capable of achieving incredibly high precision.
  • Often produces very good edge quality and little debris to eliminate post-processing.
  • Slower than photothermal cutting. 
  • Often possible to use a laser wavelength that isn’t normally absorbed by the material.
  • Ideal for demanding applications in medical device manufacturing, glass and sapphire cutting in display fabrication, and even watchmaking. 

Cutting Laser Selection Checklist

These tables are your roadmap to selecting the right cutting laser. They list some of the key factors that can impact your choice and will help prompt you to identify what truly matters for your specific application.  Use them to formulate the questions to ask when qualifying a particular laser type and specific vendor.

Process Factors 

Laser selection almost always begins by first identifying and defining the process requirements and the desired outcome. 

Cutting Method Tradeoffs

Kerf width is often an important consideration in laser cutting.

 

Factor

Notes 

Material Type  

Material characteristics usually play the largest role in determining the appropriate cutting laser. The linear absorption properties of the material (what wavelengths it absorbs), reflectivity, thermal conductivity, and melting point are generally the properties of greatest importance. The Overview Chart  offers a good starting point for matching laser to material.  

Material Thickness

Material thickness and the desired cutting speed usually dictate the necessary laser power. Thicker materials generally require higher power and slower cutting speeds to ensure clean cuts. 

Required Speed

There is often a trade-off between cutting speed and cut quality. Higher speeds may decrease precision, so balance speed with the desired cut quality. 

Heat-Affected Zone

(HAZ) 

Minimizing the HAZ is critical for heat sensitive materials and small parts. USP lasers provide the minimum HAZ achievable.  

Kerf/Edge Quality 

Certain laser/material combinations tend to deliver smoother edged cuts and less microcracking. These can both affect the subsequent mechanical strength of the cut part. Smoother edges can also reduce the need for post-processing. Keep in mind that the polarization of the beam relative to the cutting direction can have a big effect on kerf quality.

Debris Production 

High amounts of debris can increase cleanup time and necessitate more post-processing steps.  

Post-Processing 

The need (or lack thereof) of post-processing can dramatically impact overall process cost and throughput. Certain types of post-processing may also have a significant environmental impact.
Laser Factors 

With the process requirements defined, the next step is typically selecting the right laser technology. In many cases, the technical requirements of the process – the material, its thickness, the desired throughput, and so on – narrow the search to a single laser type.

 

Process Factors

  Heat-affected zone (HAZ) is another concern in many cutting applications.

 

Factor

Notes

Output Power

A certain minimum power is often required to cut a given material and thickness. Increasing the power above this threshold level raises throughput. It may also increase cost, since higher laser power generally costs more money. In some situations, there may be an optimum power, and exceeding this level might have negative consequences, such as a larger HAZ, reduced cut quality, or increased debris production. These are some of the reasons why, for both nanosecond solid-state and USP lasers, it’s common to use “multi-pass” cutting. That is, the laser scribes over the same area repeatedly to produce a through cut

Wavelength

Laser wavelength is a primary factor for two reasons. First, matching laser wavelength to material absorption optimizes cutting efficiency and speed, and often cut quality. The Overview Chart  summarizes laser compatibility with common materials. Second, shorter wavelengths typically enable greater cut precision, since they can be focused to smaller spot sizes. Depending upon the beam delivery optics, shorter wavelength may also allow greater depth of focus, which enhances process stability.

Beam Quality

(M² or BPP)

Beam quality determines how well the laser can be focused. This has two significant consequences. First, a smaller focused spot (lower M² or BPP) enables smaller kerf width cuts and the production of finer, more detailed features. Second, for a given laser power, a higher power density can be achieved in the focused spot as beam quality improves. Higher power density means more energy is delivered within a specific area, which enhances the ability to melt or vaporize the material efficiently. Better beam quality typically makes the overall power of the laser more useable.

Output Mode (Pulsed or CW)

The choice between a pulsed or continuous wave (CW) laser is highly dependent on material and desired results. Furthermore, some laser types will only operate in one of those modes. This makes it difficult to generalize. But, overall, CW lasers are usually preferred for high-speed, high-throughput applications involving thick or dense materials. Typical applications are cutting thick metal in automotive and energy applications. Pulsed lasers generally excel in providing higher precision cutting, minimal thermal impact, and processing of specialized materials. They’re often used for cutting delicate or heat-sensitive polymers, ceramics, and thin metals in emobility, semiconductor, and medical device manufacturing.

Beam Delivery

Beam delivery options, such as fiber or free-space optics, significantly impact the practical aspects of configuring a laser cutting system, as well as its associated costs. Fiber delivery offers tremendous convenience and flexibility, making it easy to integrate a cutting laser into a space-constrained production environment alongside other equipment. It also simplifies maintenance by making the laser more accessible. CO₂ lasers cannot utilize fiber delivery, resulting in more complex beam delivery systems that can be subject to misalignment over time.

Operational Consistency

Laser output variations can lead to inconsistent cuts, affecting product quality and increasing scrap rates or the need for rework. Lasers which operate with consistent output characteristics reduce maintenance downtime, ensuring continuous operation and productivity. Especially as production volumes increase, it’s critical to know how the laser manufacturer has built in and ensures operational consistency.

Cooling Requirements

Lasers often require cooling systems which utilize air or water. Water cooling may need a specific infrastructure within your facility to support it. This can have a cost associated with it.

Operating Cost

Many cutting lasers use consumables such as gases (especially assist gasses), optics, and protective windows. Different laser types also have their own maintenance requirements and reliability characteristics. And, of course, these can vary by manufacturer. Maintenance downtime in a high-volume production environment – both scheduled and unplanned – often represents a larger cost than the original purchase price of the laser itself. This makes it very important to establish realistic expectations about laser uptime and reliability and understand manufacturers’ warranties and lifetime specifications.
Implementation Factors 

Many laser manufacturers offer similar products – or at least products that appear to be similar. To choose one, practical considerations related to cost, integration factors, applications development, and ongoing support must be considered. These factors are frequently the determining factor in selecting a specific vendor. 

 

Factor

Notes

Applications Development

Vendor support in developing and optimizing your cutting process can be invaluable in many cases. If so, look for laser vendors that offer sample processing and process development assistance.

Purchase Cost

Consider the capital cost of the laser, plus installation and setup costs. Staff training may also be a cost factor. 

Operating Costs

Evaluate ongoing expenses such as maintenance, consumables, and energy usage. Some lasers have inherently lower running costs which can save money over time. Downtime is important to consider, since it may represent a larger risk factor and cost than the capital cost of the laser.

Service & Support

Evaluate the geographical availability and typical response time for service and support for potential vendors. Consider the geographical availability of spare parts to ensure minimal downtime in case of repairs or maintenance.

Software

User-friendly and versatile control software can significantly enhance productivity and ease-of-use. Ensure the software is compatible with your existing systems.

Integration

The ease of integrating the laser with your existing production line or machinery is crucial. Look for lasers with flexible interfacing options and comprehensive integration support, and make sure your specific integration and communications protocols are supported. 

Ease-of-Use

A user-friendly human-machine interface (HMI) reduces training time and operational errors. Prioritize systems that offer intuitive controls and clear operational guidance. Determine if the laser vendor offers training.
Implementation Factors

The human-machine interface (HMI) often determines the real world productivity of a laser cutting system.

 

Selection Guide by Material

The selection of a specific cutting laser technology is almost always driven by the material – its absorption characteristics and thickness, together with factors related to cutting speed and kerf quality. This table lists some common materials and the lasers typically used to cut them. 

 

Material Class

Example Lasers

Main Characteristics

Comments

Metals

Fiber

High power density enables rapid cutting and the ability to process thick materials.

Reflectivity for certain metals (e.g., aluminum, copper); requires high power with thicker substrates to ensure complete penetration. 

Nanosecond Solid-State

Provides precision for intricate cuts.

Green (frequency-doubled) output is often used for materials requiring less thermal impact and higher precision. UV (frequency-tripled) output reduces cutting speed but delivers extremely precise cuts with minimal heat-affected zones.

Ultrashort Pulse

When the highest precision is required, or for very delicate parts.

Lower throughput rates usually limit these lasers to the most demanding, precise, and heat-sensitive applications.

Polymers

 

CO₂

Extremely good absorption of their long-wave IR output leads to efficient, rapid cutting of polymers. Many manufacturers offer different wavelength options for optimum matching with material absorption.

Potential for melting and burning – varies by material.

Nanosecond Solid-State

Precise, clean cuts with minimal thermal distortion and HAZ.

The combination of edge quality and minimal HAZ makes them particularly useful in microelectronics and medical device manufacturing.

Organics (Wood, Paper, Fabric, Leather, etc.)

CO₂

Extremely good absorption of their long-wave IR output leads to efficient, rapid cutting. Many manufacturers offer different wavelength options for optimum matching with material absorption.

Potential for melting and burning – varies by material.

Glass

CO₂

Typically not used to actually cut completely through the material, but rather induce a crack which is then propagated through the part. Can only cut straight lines.

Cutting thicker glass sometimes requires a final mechanical separation step.

Nanosecond Solid-State

Produces chips in the single digit micron size range and can cut any shape.

Usually performed with green (532 nm) or ultraviolet (355 nm) lasers in “bottom-up” cutting – here the laser enters through the top of the transparent substrate and is initially focused on the bottom surface.

Ultrashort Pulse

Incredibly high precision possible, as well as the ability to cut any shape, including cut-outs. Chips are in hundreds of nanometers in size range, with often eliminates post-processing.

Usually uses infrared (1064 nm) and some form of “filamentation” cutting like Coherent SmartCleave.

Ceramics

CO₂

Best for cutting thicker ceramic materials due to their high-power output. However, they typically have a larger HAZ compared to USP and solid-state lasers.

Provides higher speed but lower precision.

Nanosecond Solid-State

Uses near-infrared, green, or ultraviolet lasers depending upon the material, required precision, and desired HAZ.

Provides a good balance between cutting speed and precision.

Ultrashort Pulse

Highest precision and smallest HAZ but slowest cutting speed. Can use near-infrared, green, or ultraviolet lasers.

Useful where minimal thermal impact is crucial, such as in medical devices, microelectronics, and advanced manufacturing.

Semiconductors

Nanosecond Solid-State

Uses near-infrared, green, or ultraviolet lasers depending upon the material, required precision, and desired HAZ.

Provides a good balance between cutting speed and precision.

Ultrashort Pulse

Highest precision and smallest HAZ but slowest cutting speed. Can use near-infrared, green, or ultraviolet lasers.

Ideal for cutting thin substrates or creating intricate patterns without causing thermal damage.

Composites

Fiber

Particularly effective for cutting composites that include metals or carbon fibers.

Good for high-speed cutting of carbon fiber-reinforced polymers (CFRP) and glass fiber-reinforced polymers (GFRP). 

CO₂

Their high power enables rapid cutting a wide range of non-metallic composites.

Ideal for cutting composites with polymer matrices, such as fiberglass, aramid composites, and other polymer-based composites.

Nanosecond Solid-State

Uses near-infrared, green, or ultraviolet lasers depending upon the material, required precision, and desired HAZ.

Effective for detailed and intricate cutting of composite materials used in automotive, aerospace, and industrial applications.

Ultrashort Pulse

Highest precision and smallest HAZ but slowest cutting speed. Can use near-infrared, green, or ultraviolet lasers.

High-precision cutting of composites where minimal thermal impact is crucial, such as in aerospace and medical applications.

Choosing a Laser Vendor

Several factors beyond just the laser/material interaction play a vital role in the overall success and efficiency of a laser cutting system in an actual production environment. These include integration capabilities, service and support, application assistance, and more. These elements can impact the laser system’s capital cost, operating expenses, downtime, required training for operating and maintenance personnel, and much more. 

Here are some key factors to consider when evaluating potential laser vendors:

Integration Capabilities
1. Supported Interfaces and Communication Protocols
  • Importance: Ensuring that the laser system can seamlessly integrate with your existing production line and equipment is crucial. Compatibility with your control systems and communication protocols can significantly affect the ease of integration and operation.

  • Considerations: Check if the vendor supports common industrial communication protocols such as Ethernet, Modbus, PROFINET, and others. 

2. Product Size and Weight

  • Importance: The physical size and weight of the laser system can impact how it fits into your existing production environment or how easily it can be integrated into a tool, such as on a robot arm. 

  • Considerations: Evaluate the footprint of the laser system and ensure it fits within your workspace. Consider the weight if the system needs to be mounted or installed in a specific location. Compact and lightweight systems can be advantageous in space-constrained environments.

3. Ease-of-Use
  • Importance: A user-friendly HMI and overall ease-of-use are critical for efficient operation to reduce training time, and to minimize operator errors. An intuitive interface can help operators quickly learn and effectively manage the laser system and implement changeovers in production with minimal downtime. 

  • Considerations: Assess the HMI for ease of navigation, clarity of information, and accessibility of controls. Look for systems that offer customizable interfaces and straightforward operational procedures. The availability of training and support from the vendor can also enhance ease-of-use.

Service and Support
1. Geographic Availability of Spare Parts and Maintenance

  • Importance: Having readily available spare parts and maintenance services can minimize downtime and ensure continuous operation. The location of the vendor’s service centers and parts depots can significantly affect response times.

  • Considerations: Check if the vendor has a robust supply chain and service network in your region. The proximity of service centers and availability of spare parts can reduce lead times for repairs and maintenance.

2. Service Response Speed
  • Importance: Quick response times for service and maintenance issues are critical to maintaining high production uptime. Delays in service can lead to significant production losses and increased operational costs.

  • Considerations: Evaluate the vendor’s average response times and their ability to provide on-site support. Consider service agreements that guarantee response times and prioritize vendors with a proven track record of prompt service.

3. Reliability and Warranty
  • Importance: The reliability of the laser system and the warranty offered by the vendor can impact long-term operational costs and confidence in the system.

  • Considerations: Investigate the reliability ratings of the vendor’s laser systems and the terms of the warranty. A comprehensive warranty can provide peace of mind and protect against unforeseen expenses.

Applications Support
1. Vendor Willingness to Process Samples
  • Importance: The ability of a vendor to process samples of your material can provide valuable insights into the laser’s performance and suitability for your specific application. This also demonstrates the vendor’s commitment to supporting your needs.

  • Considerations: Look for vendors who offer sample processing as part of their pre-sales support. This allows you to evaluate cut quality, speed, and other critical parameters before making a purchase decision.

2. Process Development Support
  • Importance: Vendors that assist in developing and optimizing your cutting processes can significantly enhance your production efficiency and quality. This support can be invaluable, especially for complex or new applications.
  • Considerations: Choose vendors that offer process development support, including the optimization of cutting parameters and integration of the laser system into your production line. Access to expert advice, experience, and technical support can help you achieve the best results.
3. Training and Documentation
  • Importance: Proper training and comprehensive documentation are essential for the smooth operation and maintenance of the laser system. Skilled operators can maximize the system’s capabilities and minimize downtime.

  • Considerations: Ensure the vendor provides thorough training programs for your staff, including initial training and ongoing education. Comprehensive documentation, including user manuals, maintenance guides, and troubleshooting tips, is also crucial.

     

Overall Vendor Reputation
1. Industry Experience and Expertise

  • Importance: A vendor’s experience and expertise in the laser cutting industry can provide confidence in their ability to meet your specific needs and challenges.

  • Considerations: Research the vendor’s history, customer base, and the range of applications they have supported. Vendors with a broad portfolio and a strong reputation are often better equipped to handle diverse and complex requirements.

2. Customer Reviews and Testimonials
  • Importance: Feedback from other customers can provide valuable insights into the vendor’s performance, reliability, and support quality.

  • Considerations: Look for customer reviews, case studies, and testimonials that highlight the vendor’s strengths and areas for improvement. Positive feedback from similar industries or applications can be particularly reassuring.

     

Choosing the right laser vendor involves evaluating various factors beyond just the technical specifications of the laser system. By considering integration capabilities, service and support, application assistance, and the vendor’s overall reputation, you can make a more informed decision that ensures long-term success and efficiency in your laser cutting operations. Make sure to conduct thorough research and engage with potential vendors to address all your concerns and requirements.

Final Thoughts

Laser cutting technology offers unparalleled precision, versatility, and efficiency, making it an essential tool across a wide range of industries. This Buyer’s Guide to Cutting Lasers provides an overview to help you navigate the complexities of selecting the right laser for your specific application. By understanding the different types of lasers, their cutting mechanisms, and the trade-offs involved, you can make informed decisions that optimize your production processes.

But in addition to picking the best type of laser, it’s also important to choose the right laser vendor. Especially in volume production settings or demanding applications, this choice can have a substantial cost impact. 

So, look for a vendor who offers comprehensive support. This starts with expertise in applications development – this can make the difference between a process that consistently delivers high-quality parts and one that has you battling scrap rates and rework. And it extends to responsive service to get you running again when problems do occur. 

This guide aims to empower you with the knowledge to ask the right questions and identify the most significant factors for your needs. By leveraging this information, you can ensure that your laser cutting operations are efficient, reliable, and cost-effective, driving success in your applications and contributing to the overall growth and innovation of your business.

Ready to take the next step? Talk to a Coherent Laser specialist.