Semiconductor Manufacturing
Support fabs from the most advanced transistor nodes all the way to legacy nodes by locating and avoiding defects, and processing advanced materials like low-κ dielectrics.
- Highest Resolution Work at the highest resolution with a wide selection of short wavelength lasers.
- Improved Sensitivity Increase defect detection sensitivity and process faster with higher powers and shorter laser wavelengths.
- UV Reliability Enjoy exceptional reliability in UV and DUV lasers thanks to our unsurpassed experience.
Wafer Inspection
Ultraviolet laser sources that provide high power for speed or enhanced detection sensitivity, plus the longest operational lifetime and uptime characteristics.
Mask Writing
Excimer and optically pumped semiconductor lasers with exceptionally high stability and reliability to power mask writing for mature nodes.
Mask Inspection
Fab certified and highly reliable 193 nm excimer lasers and 266 nm DPSS lasers, plus ion lasers that consistently identify the smallest reticle defects.
Wafer Annealing
Both visible and infrared wavelength lasers with the high power and accurate pulse length control necessary for rapid, precision dopant activation.
Wafer Dicing
High power, ultrashort pulse lasers for high throughput scribing of low-κ dielectrics and full ablative dicing, that yield high die strength and avoid delamination.
Wafer Marking
Visible and UV wavelength solid-state lasers that produce high contrast, high resolution, easily machine readable marks, without causing debris or microcracks.
Featured Blog
New 30-Watt Femtosecond Laser Lowers HAZ for OLED Shape Cutting
The Coherent Monaco UV 30-watt laser offers ideal choice for high-speed, low heat affected zone (HAZ) shape cutting for economical high-volume production of reliable, foldable OLED displays.
New Excimer Process Rapidly Creates Super Hard DLC Films at Low Temperatures
Learn how the Mittweida team at University of Applied Sciences have achieved a hardness of up to 70 GPa with Young’s moduli of 700 to 800 GPa which leads to an extremely high operational wear resistance.
The high pulse energy of LEAP enables fast deposition and annealing. The stable output and flat-top beam profile give us precise control over both the deposition and annealing processes
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