半导体设备

构建具有先进芯片和下一代封装所需的速度和准确度的制造和测试设备。

使用先进的光学和机械材料和组件，构建最大限度地提高吞吐量和产量的设备。

使用高性能的光学元件、激光器和复合材料提高划片、封装和测试的精确性及吞吐量。

Featured Blog

Materials for Better Semiconductor Packaging

Advanced materials improve thermal management to enable packaging of thinner microelectronic components.

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