Advanced Packaging and Interconnects
Maximize throughput and yields while guaranteeing high availability for the lowest cost-per-part.
- Drive Throughput Achieve highest possible throughput via power and repetition rate.
- Improve Quality Utilize maximum laser control to lessen debris and reduce post process cleaning.
- Any Material Process any material or combination, including organics, metals, and ceramics.
PCB Drilling
CO₂, nanosecond UV, and ultrashort pulsed lasers for high-precision, high throughput via drilling in various PCB compositions at even the smallest hole diameters.
Ceramic Processing
Quickly scribe and drill hard-ceramic substrates and components with ease using CO, CO₂, nanosecond UV DPSS, and ultrashort pulse lasers.
PCB Depaneling
High pulse energy nanosecond UV and ultrashort pulse lasers that offer unique capabilities for rapid, carbonization-free depaneling with minimum kerf size, even for thick panels.
Laser Marking
Easy to integrate pulsed lasers that power a wide variety of laser marking tasks on organics, ceramics, metals, and semiconductors, with highest speed, superior contrast, and best-in-class software features.
Optical Debonding
Perform debonding with high throughput and unmatched uptime using excimer and nanosecond lasers that efficiently deactivate temporary bonding adhesives.
Laser Assisted Bonding
High power diode lasers can illuminate large areas at high fluence for rapid throughput bonding with precise heat control enabling soldering of heat sensitive parts.
Featured Blog
Introducing Our New High-Power UV Laser: The Coherent AVIA LX 355-30
Learn about the new Coherent AVIA LX355-30 high-power UV laser that reduces cost per part for PCB depaneling and drilling, SiP cutting, and more.
Resource List
Amplifier Stability Enables in-situ Studies of Ferroelectric Film Polarization
See how researchers successfully used Coherent Astrella/TOPAS to determine both the degree and direction of polarization, in films from zero to 20 unit cells (u.c.).
Amplifier thermal stability is critical. Our chamber runs at up to 950°C internally and heats the lab significantly during long experiments. The power, beam shape, and pointing of Astrella are all unaffected by these ambient changes.
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