Advanced Packaging and Interconnects
Maximize throughput and yields while guaranteeing high availability for the lowest cost-per-part.
- Drive Throughput Achieve highest possible throughput via power and repetition rate.
- Improve Quality Utilize maximum laser control to lessen debris and reduce post process cleaning.
- Any Material Process any material or combination, including organics, metals, and ceramics.
CO₂, nanosecond UV, and ultrashort pulsed lasers for high-precision, high throughput via drilling in various PCB compositions at even the smallest hole diameters.
Quickly scribe and drill hard-ceramic substrates and components with ease using CO, CO₂, nanosecond UV DPSS, and ultrashort pulse lasers.
High pulse energy nanosecond UV and ultrashort pulse lasers that offer unique capabilities for rapid, carbonization-free depaneling with minimum kerf size, even for thick panels.
Easy to integrate pulsed lasers that power a wide variety of marking tasks on organics, ceramics, metals, and semiconductors, with highest speed, superior contrast, and best-in-class software features.
Perform debonding with high throughput and unmatched uptime using excimer and nanosecond lasers that efficiently deactivate temporary bonding adhesives.
Laser Assisted Bonding
High power diode lasers can illuminate large areas at high fluence for rapid throughput bonding with precise heat control enabling soldering of heat sensitive parts.
Amplifier Stability Enables in-situ Studies of Ferroelectric Film Polarization
See how researchers successfully used Coherent Astrella/TOPAS to determine both the degree and direction of polarization, in films from zero to 20 unit cells (u.c.).