Advanced Packaging and Interconnects
Maximize throughput and yields while guaranteeing high availability for the lowest cost-per-part.
- Drive Throughput Achieve highest possible throughput via power and repetition rate.
- Improve Quality Utilize maximum laser control to lessen debris and reduce post process cleaning.
- Any Material Process any material or combination, including organics, metals, and ceramics.
Easy to integrate pulsed lasers that power a wide variety of laser marking tasks on organics, ceramics, metals, and semiconductors, with highest speed, superior contrast, and best-in-class software features.
Introducing Our New High-Power UV Laser: The Coherent AVIA LX 355-30
Learn about the new Coherent AVIA LX355-30 high-power UV laser that reduces cost per part for PCB depaneling and drilling, SiP cutting, and more.
Amplifier Stability Enables in-situ Studies of Ferroelectric Film Polarization
See how researchers successfully used Coherent Astrella/TOPAS to determine both the degree and direction of polarization, in films from zero to 20 unit cells (u.c.).
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