28 GHz and 56 GHz EML FR Chip on Carrier
Use these integrated (DFB laser plus modulator) devices to build components for 28 GBd PAM4 modulation (56 Gb/s bit rate) or 56 GBd PAM4 modulation (112 Gb/s bit rate).
Integrating an electro-absorption modulator on the same carrier as the DFB laser chip provides an optimum solution for FR1, FR4 and DR/DR+ applications. These chip-on-carrier (CoC) devices are compatible with cost-effective, non-hermetic packaging.
EML Chip on Carrier
Get these compact EML products at CWDM wavelengths. They operate with high reliability over a wide temperature range (20°C to 70°C) and with high signal integrity.
Choice of 56Gb/s (28 GBd PAM4 signal mod) or 112Gb/s (56 GBd PAM4 signal mod)
Available wavelengths: CWDM
Compatible with cost-effective non-hermetic packaging
Operating temperature range 20°C to 70°C
Integrated RF termination resistor provides for improved signal integrity
Featured Success Story
Laser Framework Makes a Mark in Siemens’ Digital Factory
Coherent applications development support and Coherent Laser FrameWork software enable Siemens to successfully implement their ID Link manufacturing program.
Fabricating & Metalworking
Get exactly the right solution to your specific laser fabrication needs while delivering process quality and efficiency to metal and non-metal fabricating.
Weld and harden automotive powertrain components with lasers that eliminate distortion, reduce spatter, and are easily automated and integrated into production.