Laser Machines and Systems
eM15 Monocrystalline Diamond Cutting System
Deliver deep cuts with low taper and superior surface quality for cutting natural and synthetic monocrystalline diamond and CVD wafers.
The use of a pulsed green laser in a proprietary method enables fast, precise cutting of diamond, eliminating the slow speed and damage risk of traditional sawing. Ideal for windows, heat sinks, precision tooling, acoustic wave applications, jewelry and more.
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eM15– Cutting monocrystalline diamond and CVD wafers
Simplified control thanks to eMicro software. Choose only the level of automation and number of axes you need, including optional rotation axis for 4, 5 axis models.
Product Specifications
Model Options |
Laser Details |
Maximum (XY) Working Area (mm) |
Fixture Area (mm) |
Typical Application |
Part Loading |
Max XY Scan Speed (mm/min) |
3 axis |
15 W green (532 nm) DPSS laser |
200 x 200 |
150 x 150 |
2D (XY) cutting |
Manual, custom automated |
2000 |
4 axis |
D50 x 100 |
Shaped (3D) cutting |
||||
5 axis |
