Engineered Materials
Thermadite Liquid Cold Plates
Liquid cold plates built with Thermadite can include complex internal microchannel architectures optimized to real chip heat maps. These designs focus cooling on hot spots regions, minimizing pressure drop and coolant usage, enabling more efficient heat removal and reducing overall cooling system operating cost.
Thermadite is a reaction-bonded SiC (RB-SiC) ceramic composite engineered for extreme thermal environments. By incorporating diamond into a SiC matrix, Thermadite delivers high thermal conductivity, low coefficient of thermal expansion, high stiffness, mass-scale manufacturability and excellent dimensional stability. It is well suited for advanced semiconductor packaging, high-power electronics, and precision thermal management applications where conventional metals and ceramics fall short.
Full Assembly Solutions
We deliver more than microchannel plates. Thermadite LCPs can be provided as fully integrated assemblies, including embedded cooling, hardware, interconnects, metallization, and package-level integration. The result is a mechanically robust, thermally optimized solution ready for direct incorporation into advanced electronic systems.
Advanced Manufacturing
We translate designs into mass-produceable solutions. Our capabilities leverage the full suite of Coherent lasers and materials to deliver unmatched features, performance and scalability. We focus on repeatability, dimensional control, and inspection methods compatible with semiconductor manufacturing. Processes are developed with volume production in mind, not just prototypes.
