Advanced Thermal Management

Optimize performance across datacenter and communications applications with scalable thermal-management solutions spanning advanced cooling, thermal materials and system-level heat management—from the chip to the facility.

Single-Stage TEC Devices

Choose from a huge range of single-stage thermoelectrics designed for medium to low heat pumping capacity requirements, based on cooling capacity, size, and shape.

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Thermoelectric Generator (TEG) Modules

Use one or more Coherent TEGs to generate DC electrical power from a temperature differential (e.g., hot surface) in a wide range of consumer and industrial applications.

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Thermadite Liquid Cold Plates

Liquid cold plates built with Thermadite can include complex internal microchannel architectures optimized to real chip heat maps.

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CVD Diamond Substrates

Enjoy the benefits of diamond's unique properties – very broad transmission range, extraordinary hardness, and high resistance to thermal shock and thermal lensing.

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SiC Substrates & Epitaxy

Fabricate a wide range of high-performance power electronics devices on high-quality SiC wafers as large as 200 mm in diameter.

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Featured Blog

Cooling Solutions for Overworked Datacenters

Discover how Coherent is solving the hottest challenge for AI-fueled datacenters with cold plate cooling.

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Enabling Advanced Thermal Management Solutions

Advanced Thermal Management for Next-Generation Technologies

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