Datasheet
Diode Lasers
9 W 9xx nm 90 μm High Power Single Emitter Laser Diode on Submount
The Coherent SES9-9xx-01 single emitter laser diode series has been designed to provide the high output power, high coupling efficiency and high reliability required for pumping next generation fiber lasers and for other high power laser diode applications. The proprietary E2 front mirror passivation process, developed at our Zurich site, prevents Catastrophic Optical Damage (COD) to the laser diode facet even at extremely high output powers. The single emitter laser diodes are p-side down mounted on an optimized submount providing very low thermal resistance
Applications
- Fiber laser pumping
- Material processing
- Printing
- Medical
Features and Benefits
- 3.6 mm x 0.4 mm laser diode
- 90 μm wide emitter
- 9 W operating power (p-side down mounted)
- Highly reliable single quantum well structure
- Standard wavelength at 915, 940, 975 nm (other available on request)
- RoHS compliant
Datasheet
| Parameter | SES9-975X-01 |
|---|---|
| Package | Chip on Submount |
| Operating Condition | Continious Wave (CW) |
| CW Electrical and Optical Specification1 | |
| Threshold Current (mA) | 500 (typ.) |
| Operating Forward Current (A) | 9.5 (typ.) |
| Operating Forward Voltage (V) | 2.2 (typ.) |
| Output Power (W) | 9 (typ.) |
| Center Wavelength (Centroid) (nm) | 975 |
| Center Wavelength Range (nm) | 905 - 985 |
| Center Wavelength Tolerance (nm) | ±3 / ±10 |
| Spectral Width (FWHM) (nm) | 4 (typ.) |
| Wavelength Shift with Temperature (nm/K) | 0.3 (typ.) |
| Beam Divergence, parallel to junction / slow axis (FWHM) (deg) | 8 |
| Beam Divergence, perpendicular to junction / fast axis (FWHM) (deg) | 23 |
| Slope Efficiency (W/A) | 1.0 (typ.) |
| Conversion Efficiency (%) | 50 (min.) |
| Series Resisance (Ohm) | 0.03 (typ.) |
| Polarization | TE |
| Dimensions | |
| Chip Width (µm) | 400 |
| Chip Thickness (µm) | 150 |
| Emitter Width (µm) | 90 |
| Resonator Length (µm) | 3600 |
| Package Width (mm) | 4.05 |
| Package Length (mm) | 3.9 |
| Package Thickness (mm) | 0.4 |
| Package Height incl. Wire Bonds (mm) | 1.2 |
| Miscellaneous | |
| ROHS Compliance | compliant (China RoHS 2) |
| Laser Safety | Class 4 Laser Product |
| Lead Soldering Temperature2 (60 s max) (°C) | 250 (max.) |
| Comment | Manufactured in the Philippines |
Notes:
1. Operating characteristics (BOL)
Conditions unless otherwise stated:
Submount temperature: 25 °C, CW operation
All specified values depend on mounting technology and operating conditions
2. No flux