Datasheet

Diode Lasers

4 W 9xx nm 44 μm High Power Single Emitter Laser Diode on Submount

Product image of 4 W 9xx nm 44 μm High Power Single Emitter Laser Diode on Submount

The Coherent SES4-940x-01 single emitter laser diode series has been designed to provide higher output power, and higher efficiency required for Flexo pre-press printing and for other high power laser diode applications. The proprietary E2 front mirror passivation process, developed at our Zurich site, prevents Catastrophic Optical Damage (COD) to the laser diode facet even at very high output powers. The single emitter laser diodes are p-side down mounted on an optimized submount providing very low thermal resistance.

Applications

  • Flexo Pre-press Printing
  • Material processing
  • Medical

Features and Benefits

  • 44 μm wide emitter
  • 4 W operating power (p-side down mounted)
  • Highly reliable single quantum well structure
  • Standard wavelength at 940nm (other available on request)
  • RoHS compliant
Parameter SES4-940x-01
Package Chip on Submount
Operating Condition Continious Wave (CW)
CW Electrical and Optical Specification1
Threshold Current (mA) 250 (typ.)
Operating Forward Current (A) 5 (max.)
Operating Forward Voltage (V) 1.7 (typ.)
Output Power (W) 4 (typ.)
Center Wavelength (Centroid) (nm) 940
Center Wavelength Range (nm) 905 - 985
Center Wavelength Tolerance (nm) ±3 / ±10
Spectral Width (FWHM) (nm) 4 (typ.)
Wavelength Shift with Temperature (nm/K) 0.3 (typ.)
Beam Divergence, parallel to junction / slow axis (FWHM) (deg) 7
Beam Divergence, perpendicular to junction / fast axis (FWHM) (deg) 28
Slope Efficiency (W/A) 1.0 (typ.)
Conversion Efficiency (%) 53 (typ.)
Series Resisance (Ohm) 0.03 (typ.)
Polarization TE
Dimensions
Chip Width (µm) 400
Chip Thickness (µm) 150
Emitter Width (µm) 44
Resonator Length (µm) 3600
Package Width (mm) 4.05
Package Length (mm) 3.9
Package Thickness (mm) 0.4
Package Height incl. Wire Bonds (mm) 1.2
Miscellaneous
ROHS Compliance compliant (China RoHS 2)
Laser Safety Class 4 Laser Product
Lead Soldering Temperature2 (60 s max) (°C) 250 (max.)
Comment Manufactured in the Philippines

Notes:
1. Operating characteristics (BOL)
Conditions unless otherwise stated:
Submount temperature: 25 °C, CW operation
All specified values depend on mounting technology and operating conditions
2. No flux