Lasers
DIAMOND J-Series
Cut, drill, engrave, scribe and mark a wide variety of materials including plastics, metals, composites, PCBs, flex circuits, wood, die boards, paper, and cardboard.
Combines power, excellent beam quality, and nearly square wave pulses for high processing efficiency and speed. With small heat affected zone, plus compact, fully sealed, slab discharge construction for enhanced reliability and low cost-of-ownership.
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J-Series Product Overview
Utilize lasers featuring common mechanical, electrical, optical, software, and control interfaces for simplified integration and reduced time-to-market.
Product Specifications
Model |
Wavelength (μm) |
Average Power (W) |
Peak Power (W) |
Width x Height (mm) |
Length (mm) |
DIAMOND J-2-9.4 |
9.4 |
160 |
≥450 |
198.1 x 227.6 |
830.5 |
DIAMOND J-2-10.2 |
10.2 |
150 |
≥400 |
||
DIAMOND J-2-10.6 |
10.6 |
180 |
≥450 |
||
DIAMOND J-3-9.4 |
9.4 |
250 |
≥750 |
1064.1 |
|
DIAMOND J-3-10.2 |
10.2 |
225 |
|||
DIAMOND J-3-10.6 |
10.6 |
250 |
|||
DIAMOND J-5-9.4 |
9.4 |
400 |
1700 |
1225 |
|
DIAMOND J-5-10.6 |
10.6 |
450 |
1800 |
||
DIAMOND J-6-10.6 |
10.6 |
500 |
1200 |
