
Coherent HELIOS lasers, in the IR and the Green, allow for picosecond precision in a variety of micromachining and microelectronics applications.
The high peak power from pulse durations as low as a few hundred picoseconds allows HELIOS to deliver an effective number of photons to the sample. The laser pulse is also delivered with high precision in timing due to its electro-optical Q-switch. This Q-switch is faster and more precise in switching than standard acousto-optical devices found in competitive technology. The digital controller design is easy and cost-efficient to integrate into OEM designs. Combine this with the rugged design and components from Coherent’s vertical supply chain, and this makes HELIOS the low cost of ownership solution in micromachining and microelectronics applications.
The actively Q-switched Helios laser allows for better precision in a variety of micromachining and microelectronics applications.
Helios translates MOPA (Master Oscillator and Power Amplifier) technology into performance enabling applications. Delivering pulse lengths of hundreds of picoseconds in a compact and rugged package, the Helios allows for results not possible with longer nanosecond pulse lengths.
HELIOS 1064-2.5-50
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HELIOS 1064-5-50
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HELIOS 1064-6-125
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HELIOS 532-1-50
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HELIOS 532-1.5-50
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HELIOS 532-3-50
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HELIOS 532-4-125
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Wavelength
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1064 nm
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532 nm
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Average Power
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2.5W
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5W
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6W
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1W
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1.5W
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3W
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3.75W
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Pulse Energy (at set point)
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>50 µJ
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>100 µJ
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>45 µJ
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>20 µJ
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>30 µJ
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>60 µJ
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>30 µJ
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Laser Control Electronics
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Digital, OEM1
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Operational Mode
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Actively Q-switched
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Pulse Repetition Frequency Range
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Single-shot to 70 kHz
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Single-shot to 125 kHz
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Single-shot to 70 kHz
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Single-shot to 125 kHz
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Set Point for Guaranteed Specifications
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50 kHz
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125 kHz
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50 kHz
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125 kHz
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Pulse Width (FWHM)
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<0.79 ns
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<0.69 ns
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<0.95 ns
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<0.69 ns
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<0.85 ns
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Spatial Mode
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TEM00 (M2 < 1.25)
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Beam Diameter (Gaussian Fit, 1/e2)
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3.5 mm
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2.5 mm
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2 mm
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Polarization
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Linear
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Jitter (between sequential pulses, gating mode)
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< ±2 ns
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Jitter (trigger to laser pulse, single pulse triggering)
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< ±2 ns
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< ±5 ns
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< ±2 ns
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< ±5 ns
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Laser Assembly Type
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Type A
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Type B
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Type A
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Type B
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Laser Head Size(W x H x L)
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128 x 177 x 270 mm (5 x 7 x 10.6 in)
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128 x 104 x 257 mm (5 x 4.1 x 10.1 in)
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128 x 177 x 270 mm (5 x 7 x 10.6 in)
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128 x 104 x 257 mm (5 x 4.1 x 10.1 in)
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Laser Elextronics Size (W x H x L)
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integrated
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150 x 45 x 130 mm (5.9 x 1.8 x 5.1 in)
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integrated
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150 x 45 x 130 mm (5.9 x 1.8 x 5.1 in)
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Laser Head Weight
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9.5 kg (20.9 lbs)
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5.6 kg (12.3 lbs)
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9.5 kg (20.9 lbs)
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5.6 kg (12.3 lbs)
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Laser Electronics Weight
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integrated
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1.4 kg (3.0 lbs)
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integrated
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1.4 kg (3.0 lbs)
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Base Plate Temperature
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20 to 30 °C
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Storage Condition
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-10 to +50 °C
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Relative Humidity2
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80%
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Cable Length Laser Head
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none
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1 m
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none
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1 m
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Operating Voltage
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24V ± 2
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Supply Current 3
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<5A
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<10A
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<5A
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<10A
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1 Power supply not included, PC required
2 Related to the base plate temperature
3 Higher inrush current may occur
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