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Diode-Pumped Solid-State Lasers

Coherent's diode-pumped solid-state portfolio includes pulsed and short-pulsed Q-switched, modelocked, and CW lasers that enable a wide range of materials processing, scientific, and life sciences applications.


 
Diode-Pumped Solid-State Lasers

  • Flexibility and performance—today and in the years to come
  • State-of-the-art manufacturing facilities
  • Experience you can trust
CW Solid-State Lasers
Diode Module and Optically Pumped Semiconductor Laser (OPSL) technologies.
OBIS Lasers
Industrial Ultrafast
Picosecond laser portfolio with output powers up to 50W and wavelengths from 355 nm to 1064 nm.
QCW and Modelocked
QCW and modelocked lasers with output power from 2W to 24W at 355 nm or 532 nm.
paladin
Short-Pulsed Lasers
Short pulse lasers with nanosecond, sub-nanosecond or picosecond pulses.
Helios
Pulsed Q-Switched
Q-switched systems with rep. rates from 1 to 350 kHz and wavelengths in the IR, visible, & UV.
AVIA
Continuous-Wave (CW)
Output power from 10 mW to >10W, with wavelengths in the IR, visible and UV.
Mephisto
 

Application
Material
Product
Atomic and Molecular Spectroscopy
Scientific
Atom, Molecule
• FLARE
• HELIOS
• MBD 266
• MBD-200
Bio-Medical Research
Bio-Research
Life Sciences
Fluorescence Excitation
• Compass Lasers
• FLARE
• HELIOS
Cell Research
Cell Research
Life Sciences
Fluorescence Excitation
• Compass Lasers
Confocal Microscopy
Microscopy
Life Sciences
Fluorescence Excitation
• Compass Lasers
Cutting
Cutting glass with Talisker laser.
Display
Glass
• AVIA 355-33
• 
• Talisker 500 355-10
• Talisker Ultra 355-4
Drilling metal with Talisker laser.
Materials Processing
Metal
• AVIA 355-33
• 
• Talisker 500 1064-25
• Talisker 500 532-15
• Talisker Ultra 1064-16
• Talisker Ultra 532-8
Cutting with Matrix Laser
Materials Processing
Ceramic, FPD, Glass, Metal, Polymer, Sapphire, Solar Cell/Panel, Wafer
• AVIA 355-33
• 
• MATRIX Family of DPSS Lasers
Dicing
Silicon dicing with Talisker laser.
Microelectronics
Silicon
• AVIA 355-33
• 
• Talisker 1000 and HE
Dicing/Scribing
Laser Scribing with Matrix Laser
Materials Processing, Microelectronics
Ceramic, FPD, Glass, Metal, Polymer, Sapphire, Solar Cell/Panel, Wafer
• AVIA 355-33
• 
• HELIOS
• MATRIX Family of DPSS Lasers
Disk Mastering
Disk Mastering Azure
Microelectronics
Photopolymer
• Azure
Doping
Laser Doping
Materials Processing
Semiconductor, Solar Cell/Panel, Wafer
• Paladin 355
Drilling
Cutting glass with Talisker laser.
Display
Glass
• AVIA 355-33
• 
• Talisker 500 355-10
• Talisker Ultra 355-4
Drilling metal with Talisker laser.
Materials Processing
Metal
• AVIA 355-33
• 
• Talisker 500 1064-25
• Talisker 500 532-15
• Talisker Ultra 1064-16
• Talisker Ultra 532-8
Laser Drilling with Matrix Laser
Materials Processing
Ceramic, Flexible PCB, FPD, Glass, Metal, Photopolymer, Sapphire, Wafer
• AVIA 355-33
• 
• MATRIX Family of DPSS Lasers
Engraving
Laser Engravingwith Matrix Laser
Materials Processing
Mould, Tool
• MATRIX 1064
Fiber Bragg Grating
Fiber Bragg Grating Azure
Microelectronics
Fiber
• Azure
Flat Panel Display
Flat Panel Display
Materials Processing
ITO
• AVIA 355-23
• AVIA 355-33
• 
Flat Panel Display l Through Holes
Flat Panel Display
Microelectronics
Glass
• AVIA 355-23
• AVIA 355-33
• 
Flex Circuit Via Holes
Laser Drilling with Matrix Laser
Microelectronics
Copper, Polymer
• AVIA 355-14
• AVIA 355-23
• AVIA 355-33
Flow Cytometry
Flow Cytometry
Life Sciences
Fluorescence Excitation
• Compass Lasers
IC Package Singulation
Materials Processing
FBGA, QFN
• AVIA 355-23
• AVIA 532-38
Inspection
Laser Inspection
Electronics Inspection
Disk Drive, Electronic Component Surface, FPD, LCD, PC Board, Reticle, Wafer
• Compass 115M
• Compass 215M
• Compass 315M
Laser Drilling with Matrix Laser
Microelectronics
Mask, Wafer
• Paladin 355
Laser Direct Imaging (LDI)
Laser Direct Imaging
Materials Processing
PC Board
• Paladin 355
LED Substrate Scribing
Avia lasers for Silicon Scribing
Materials Processing
Sapphire
• AVIA 266-3
Low-k Dielectric Scribing
Silicon Wafers
Microelectronics
Silicon
• AVIA 355-23-250
• AVIA 355-33
• 
Marking
Laser Marking with Matrix Laser
Materials Processing
Ceramic, Electronics, FPD, Glass, Hard Disk, Indent card, LCD, Medical Device, Metal, Plastic, Solar Cell/Panel, Wafer
• HELIOS
• MATRIX Family of DPSS Lasers
Marking with AVIA Laser
Materials Processing
Plastic, Silicon
• AVIA 355-7
• 
• HELIOS
Glass Marking with AVIA
Materials Processing
Glass
• AVIA 266-3
• 
• HELIOS
Materials Processing
Metal
• AVIA 266-3
• AVIA 355-23
• AVIA 532-38
• 
• HELIOS
Micromachining
Micromaching ceramic or glass with Talisker laser.
Materials Processing
Ceramic, Glass
• AVIA 355-33
• 
• Talisker 1000 and HE
Printed Circuit Board Via Holes
Microelectronics
Copper, FR4, Glass Reinforced Nylon
• AVIA 266-3
• AVIA 355-14
• AVIA 355-23
Repair
Materials Processing
Mask, Memory
• HELIOS
• MATRIX Family of DPSS Lasers
• Paladin 355
Selective Removal
Selective removal of thin films on glass, ITO.
Display
Flat Panel Display, Glass, ITO, Thin Film
• Talisker 500 355-10
• Talisker 500 532-15
• Talisker Ultra 355-4
• Talisker Ultra 532-8
Selective removal of thin films on Si solar cells.
Solar
Si Solar Cell, Thin Film
• Talisker 500 355-10
• Talisker 500 532-15
• Talisker Ultra 355-4
• Talisker Ultra 532-8
Selective removal of thin films on CIGS solar cells.
Solar
CIGS Solar Cell, Thin Film
• Talisker 500 1064-25
• Talisker 500 532-15
• Talisker Ultra 1064-16
• Talisker Ultra 532-8
Semiconductor Wafer Inspection
Semiconductor Wafer Inspection
Microelectronics
Wafer
• Azure
Silicon Devices Micromachining
Silicon Wafers
Materials Processing
Silicon
• AVIA 266-3
• AVIA 355-23
• AVIA 532-38
Silicon Wafer Scribing and Dicing
Silicon Wafers
Microelectronics
Silicon
• AVIA 355-23-250
• 
Small Medical Micromachining
Materials Processing
Copper, Gold, Stainless Steel
• AVIA 266-3
• AVIA 355-23
Stereolithography
StereoLithography with Matrix Laser
Materials Processing
Photopolymer
• MATRIX 355
• Paladin 355
Thin Film Patterning
Thin Film Patterning with Matrix Laser
Materials Processing
FPD, ITO layers, Solar Cell/Panel
• AVIA 355-33
• 
• MATRIX Family of DPSS Lasers
Thin Film Pattern
Materials Processing
FPD, Solar Cell/Panel, Wafer
• AVIA 355-33
• 
• Paladin 355
Thin Film Scribing
Thin Film Scribing
Materials Processing
FPD, Solar Cell/Panel, Wafer
• AVIA 355-33
• 
• HELIOS
• MATRIX Family of DPSS Lasers
Thin Film Solar Cell Ablation
Wafer Edge Isolation Avia
Materials Processing
Metal, Semiconductor, Silicon
• AVIA 266-3
• AVIA 355-23
• AVIA 532-38
• 
Trimming
Laser Trimming with Matrix Laser
Materials Processing
Quartz, Resistor
• MATRIX 1064
• MATRIX 532
Wafer Solar Cell Ablation
Wafer Edge Isolation Avia
Materials Processing
Silicon
• AVIA 355-14
• AVIA 355-23
• 
Wafer Solar Cell Edge Isolation
Wafer Edge Isolation Avia
Materials Processing
Silicon
• AVIA 266-3
• AVIA 355-23
• AVIA 532-38
• 
 

Coherent is the world's largest supplier of compact solid-state lasers. With more than fifteen years of DPSS experience, we are already creating third- and fourth-generation solid-state systems.

We have accumulated more than 100 million hours of running time on more than 20,000 DPSS lasers around the world, which provides our technical team with input for designing increasingly reliable systems and applications.

We invite you to explore the possibilities...

 

Through 25 years of experience in ion laser manufacturing, Coherent has developed and refined successful process control techniques. The industry's only robotic processing ensures the most exacting and consistent assembly possible.

Designing and producing critical components, such as diodes and optics, for our own systems enhances product quality. The resulting reliability and performance of the thousands of systems we have manufactured reflects this uncompromising commitment to quality.

 
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