HYPER RAPID

Family of picosecond lasers with 25W, 50W, and 100W at 1064 nm and 1000 kHz.


 
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  • Lasers and Laser-based Systems
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The HYPER RAPID family of high power industrial picosecond lasers are the higher power versions of the transient-amplifier RAPID-series.

THE HYPER RAPID family consists of a 25W, a 50W and a 100W version and uses a novel LUMERA LASER Technology to reach higher average power for high throughput applications in ps-laser micromachining.

The newest member of this industrial ultrafast laser family, the HYPER RAPID 100 is the first ever to offer pulse-on-demand and burst mode operation in a 100W laser system, enabling a whole range of new processes for machining brittle materials such as ceramics, sapphire and glass. Plus, with a lower cost-per-watt ratio than previous system, applications that weren't previously economically feasible are now possible.

 

  • 25W/50W/100W at 1064 nm and 1000 kHz
     
  • Pulse on demand
     
  • High beam quality M² < 1.3 and M² < 1.4
     
  • Burst mode
     
  • Superior beam parameter and pointing stability across the complete PRF range
     
  • Industry approved
     
  • Low maintenance
     

 

 
 
HYPER RAPID 25
HYPER RAPID 50
HYPER RAPID 100
Wavelength
1064 nm (532 nm and 355 nm optional)
Pulse Repetition Rate (kHz)
200 to 1000
400 to 1000
400 to 1000
Spatial Mode
TEM00 (M2 < 1.3)
TEM00 (M2 < 1.4)
TEM00 (M2 < 1.4)
Pulse Duration (ps)
<15
Pulse-to-Pulse Energy stability (% rms)
<1 at 1064 nm and 500 kHz
Average Power Stability over 8 hours (% rms)
<1 at 1064 nm and 500 kHz
Polarization Ratio
>>100:1
Beam Divergence, Full Angle (mrad)
<1
Out of Laser Head (at 1064 nm)
<1.5 Out of Module (at 1064 nm)
<1
<1
Beam Circularity (%)
>85
Beam-Pointing Stability in Full PRF range (µrad / °C)
<50
Electric Supply
100 to 230 VAC/50 to 60 Hz
100 to 230 VAC/50 to 60 Hz/2.5 kW
100 to 230 VAC/50 to 60 Hz/2.5 kW
Beam Diameter (μm)
~3000 (Out of Laser Head at 1064 nm)
~1600 (Out of Module at 1064 nm)
~3000 at 1064 nm
~3000 at 1064 nm
Bore-Sight Accuracy
±0.5 mm and <5 mrad
Warm-Up Time
<40 min from chiller start
 

  • Glass, Ceramics, Sapphire Cutting & Dicing
     
  • Glass Drilling
     
  • TCO Structuring
     
  • Printing and Embossing Tools
     
  • Functional Surfaces
     
  • µ-via drilling
     
  • Injector nozzle drilling
     

 

 
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