Talisker™ is a new family of high peak power and high average power picosecond lasers designed specifically for materials processing. Based on a scalable fiber laser platform, Talisker is designed for an industrial environment and meets the availability requirements of demanding industries. Delivering picosecond pulses, these lasers minimize the heat affected zone to enable smaller feature sizes for high precision micromachining. Minimizing thermal damage enables a new range of high precision applications such as silicon machining, wafer dicing, solar cell manufacturing and glass scribing with unprecedented quality. Available at either of the specific wavelengths of 1064 nm, 532 nm and 355 nm or in a package that includes all three wavelengths, Talisker lasers process a wide variety of materials, including silicon, polyimide, metals, ”hard materials,” and glass.

Talisker products offer three different wavelengths. For more detailed information regarding Talisker please visit the links below.

Products

Features

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NEW Talisker White Paper Available Micromachining of Glass Using a Fiber-Based, High Average Power Picosecond Laser To learn how Talisker enables challenging applications such as laser scribing and what benefits it provides to OEMs please click here.

 

 

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