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NEW MATRIX 355 |
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MATRIX products are available at three wavelengths,
two beam diameters and various different power classes to optimally cope
with the flexible demands of todays material processing applications.
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MATRIX lasers enable a range of industrial applications such as:
Related links: |
Features include:
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MATRIX is optimized for cost-sensitive applications with high throughput which do not allow compromises in process quality. The lasers are manufactured utilizing Coherent’s PermAlign technology, a special process for optimal adjustment and fixation of optical components by a soldering process. This guarantees best optical alignment and stability over the whole lifetime of the product. For pumping Coherent's AAA pump diodes with MTBFs >40,000 hours are applied. The MATRIX lasers are manufactured in cleanrooms and then hermetically sealed. The result is reliable, hands- and maintenance-free operation over thousands of hours. |
| Coherent’s PermAlign technology designed for aligning and soldering optical components. |
The three MATRIX UV models feature 0.5W and 1W at 60 kHz, and 1.5W at 70 kHz. The unique multi-pass harmonics enable lower power density inside the frequency conversion crystal, resulting in longer system life, outstanding pointing stability and the lowest pulse-to-pulse noise commercially available.
The MATRIX UV BE model (= MATRIX UV with internal Beam Expander) is designed as a successor to AVIA™ Ultra 1000 and AVIA Ultra 2000 systems. MATRIX UV BE lasers have the same beam diameter and divergence specifications, and allow the same beam exit location as the AVIA models.
The MATRIX 532 nm models can be operated in single pulse mode and at repetition rates up to 100 kHz (MATRIX 532-7-30), 200 kHz respectively (MATRIX 532-8-100). The lasers feature 7 Watts of output power at 30 kHz, 8W Watts respectively at a high repetition rate of 100 kHz. They are optimized for high-throughput applications. As the IR and UV models also MATRIX 532 comes with high power stability (<2%), low pulse-to-pulse noise (typically < 2%), high-finesse output beam (M2 < 1.3) and superior pointing stability (max. 15 µrad/°C). MATRIX 532 is the tool of choice for e.g. P1/P2/P3 thin-film patterning of a:Si, CdTe, and CIGS solar cells as well as dicing, scribing, trimming of semiconductor materials, and cutting and drilling of polymers e.g. in medical techniques.
Each of the two MATRIX IR models feature repetition rates, pulse energies and pulse durations matched to the needs of specific applications. MATRIX 1064-10-30 for example runs from single pulse up to 100 kHz and is ideally suited for high throughput marking and scribing. MATRIX 1064-7-10 features high peak-power (max. >50 kW), making it an ideal choice for fast and precise material removal e.g. patterning, scribing, trimming, or engraving.
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MATRIX 355 Data Sheet |
MATRIX Laser Sofware (zip) |
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MATRIX 532 Data Sheet |
DPSS Lasers for Marking Applications Article |
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MATRIX 1064 Data Sheet |
UV Micromachining Aritlce |
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MATRIX Accessories Data Sheet |
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Key benefits for your material processing application:
MATRIX targets high process speeds and high process quality, all while lowering production costs. A specific controller concept has been developed that allows complete control of every laser pulse: energy and timing, from the first to the last pulse. The user can select the optimum pulse mode from a broad spectrum for his application.
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