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Microvia Drilling in PCBs
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Coherent lasers & microvia drilling in PCBs
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The PCB industry is experiencing a tremendous increase in demand for multilayer boards (MLBs) and high-density interconnect structures (HDISs) used in mobile phones, PDAs, avionics, computers, and the like. This extraordinary demand, coupled with accelerating product cycles, has created a vigorous market for microvias and the equipment used to manufacture them in high volume. There are four microvia formation technologies: lasers, photovia, mechanical drilling, and plasma etching. Each technology has its inherent advantages and disadvantages. The clear leader when considering cost per via, quality, size and dynamic range and throughput is laser. The following graph shows the dynamic range in hole sizes that the current laser technology offers.
Over 90% of microvia are formed with laser technology as shown in the figure below.
As the leading supplier of lasers to the microvia industry, Coherent lasers are used to produce blind, buried or through microvias. Coherent's DIAMOND sealed pulsed and Q-switched CO2 lasers are used to drill >70 µm diameter vias in RCC (resin-coated copper), Fr4 and aramid-based dielectrics. In addition, they can be used for the Cu-direct drilling process used by leading-edge PCB manufacturers. The AVIA series diode-pumped UV lasers are ideal for drilling <70 µm diameter vias in RCC, and PTFE-based dielectrics. In addition, they are the laser of choice for drilling copper apertures to expose dielectric for subsequent microvia formation.
If you need more information about Coherent´s Advanced Packaging and Interconnects products, email us at API@CoherentInc.com
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