Silicon Scribing, Cutting, Dicing
Microelectronics
Coherent lasers help enable rapid advances in a wide range of microelectronics applications: smaller and more powerful smartphones, brighter and more efficient mobile screens and TVs, and faster computer chips.

 

Find the Laser Solution that Fits
your Application Needs.

Search Applications Notes

Search by material
and/or process.





View All Application Notes

At Coherent, we have many years of experience of working with laser applications in microelectronics manufacturing. We categorize the applications where our lasers play a role into four (4) areas:

  • Flatpanel Displays: This area encompasses laser applications used to produce mobile screens and TVs.
  • Advanced Packaging and Interconnects (API): This area refers to back-end semiconductor manufacturing applications all the way up to printed circuit board (PCB) applications.
  • Semiconductor Manufacturing: This area refers to front-end semiconductor manufacturing processes, mainly inspection.
  • Micromachining: This area refers to other microelectronics applications that do not necessarily fit in the above categories, e.g. drilling of ink-jet nozzles.

 

Flat Panel Displays (FPD) have become the focal point of today’s mobile communication, as well as personal computing up to the 3D TV experience. Coherent provides laser-based solutions for a wide range of applications for the FPD industry, including the production of Low Temperature Poly-Silicon (LTPS) essential for the TFT backplane of advanced LCD and OLED displays, cutting glass and foils, direct laser patterning, marking, engraving, welding, and many more. As the world's largest supplier of lasers, Coherent offers state-of-the-art laser systems from the UV to IR. For selected applications, Coherent provides optimized beam delivery systems that support the wide range of laser applications in the FPD industry.

Coherent lasers are designed to operate in industrial environments with the highest reliability and lowest cost of operation. In addition to this, Coherent is actively involved with key industry leaders in developing customized leading-edge solutions in its world-class laser processing centers.

 

Coherent provides laser-based solutions for a wide range of applications within the advanced packaging and interconnects industry including microvia drilling in PCBs, flex circuit machining, ceramics processing, trimming, and reflow soldering. As the world's largest supplier of lasers, Coherent offers state-of-the-art laser systems ranging in wavelength from 10.6 µm to 157 nm in CW, pulsed and Q-switched platforms.

Coherent lasers are designed to operate in industrial environments with the highest reliability and lowest cost of operation. In addition to this, Coherent is actively involved with key industry leaders in developing customized leading-edge solutions in its world-class Laser Processing Center.

 

In front-end semiconductor manufacturing, lasers are mainly used in two applications: in lithography tools and in inspection. There are many different inspection steps in a modern semiconductor lab and Coherent lasers are used in most of them: Mask inspection, bare and patterned wafer inspection. Coherent has many years of experience building lasers for these very demanding applications, which require ultra-high precision and no unscheduled down time.

 

As sizes fall into the sub-micron range, mechanical approaches to cutting, drilling and processing materials like metal, ceramic, glass, or diamonds must be replaced by laser beam techniques.

  • Miniaturizing components in electronic products and modern medical devices
  • Manufacturing micromotors that are as small as a human hair
  • Ablating glass for applications in optics
  • Machining of ceramics that are needed in actuators and high temperature components
  • Drilling of implantable medical devices and complex catheters with miniature wires, fibers, probes, and sensors that are used for minimal invasive surgical and diagnostic procedures

Applications requiring machining in sub-micron dimensions include 3D micro-structuring, marking, microholes, rapid prototyping, wire stripping, and drilling of glass.

The examples below show different structures/different materials cut out with an excimer laser.

         

(Images courtesy of FHG ILT Aachen)

 
.