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FR4 Cutting with the K2K CO2 Laser

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  • Composite
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  • Ablation-Material Removal
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Product Photo
G- and K-Series 9-Micron - The 9-micron lasers are designed to efficiently process materials like polyimide, silicone and other plastics that exhibit higher absorption in the 9-micron region.
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Summary:
Glass-reinforced epoxy circuit boards (FR4) typically char when cut with a CO2 laser. This charring may be greatly reduced by using a laser with high peak power, such as the Coherent CO2 K2K, in conjunction with an acousto-optic modulator.
Laser Used:
G- and K-Series 9-Micron
Process:
The output beam from a Coherent K2K laser was passed through an optical system consisting of an aperture, an acousto-optic modulator, an optical isolator (to eliminate back reflections from reaching the laser), and a circular polarizer. The modulator was synchronized with the laser to reduce pulse rise-and-fall times to less than 1 µsecond. The resulting output was focused by a 63-mm focal length lens. FR4 boards of 1 mm thickness were cut using multiple passes.
Results:
Breakdown of the epoxy matrix was greatly reduced in comparison with standard laser cutting technology. Some darkening of the matrix occurred but charring was eliminated.

Applications Photo
Fig. 1 - Edge of 1-mm-Thick FR4.
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Comments:
There is considerable variance in the exact composition of FR4 materials. Certain formulations exhibit more degradation than others when laser processing is used. The optimum process settings use very wide pulse spacing, creating an edge that is slightly serrated under magnification.
Keywords:
Material Composite
Process Cutting and Scribing
Ablation-Material Removal