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Activation of Dopants with UV Excimer Lasers
UV excimer lasers are enabling tools in the formation of ultra shallow junctions (USJ) for ever smaller CMOS logic devices such as CPUs and memory chips, of power devices such as insulated gate bipolar transistors ...  more

Alumina Drilling and Scribing with CO₂ Lasers
Aluminum oxide or alumina (Al₂0₃) is the standard substrate material for high-performance electronic circuits. The circuit fabrication process commonly requires that this substrate be scribed, drilled, or cut. The CO₂ laser is particularly well matched ...  more

Aluminum Nitrite (AlN) Processing with CO₂ Lasers
Aluminum nitride (AlN) is beginning to replace alumina as a substrate and heat sink for electronic circuits. This is because AlN offers a much higher thermal conductivity (about eight times that of alumina), and is ...  more

Analysis of Solid Samples with the 193nm Excimer Laser
Excimer laser ablation in combination with inductively coupled plasma-mass spectrometry (LA-ICP-MS) is a powerful technique for reliable solid sample analysis. The sample is excimer laser ablated at 193nm in an air-tight chamber and the originating ...  more

Annealing of Silicon Backplanes with 540W Excimer Lasers
Excimer Laser Annealing (ELA) is a key process for making Low Temperature Poly-Silicon (LTPS) used in flat panel displays. Here the rectangular beam from a 308 nm excimer laser is homogenized and formed to produce ...  more

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